VIDEO
Addressing critical advanced packaging challenges in chipmaking
Video Summary
Ming Li, vice president of strategic projects (dielectrics), Deposition Product Group at Lam Research, discusses the recent launch of the company’s VECTOR® TEOS 3D - a breakthrough dielectric film deposition system developed specifically for advanced packaging, as part of Lam’s broader portfolio – which is currently installed (or being installed) at leading logic and memory fabs. Ming Li highlights the innovative capabilities of the new solution: delivers thick, high-quality dielectric films void-free, high-aspect ratio performance, proprietary wafer clamping for high-bow wafers, backed by Lam’s deposition and integration expertise.
